1238 — T3G selects Cadence Incisive Platform to Speed Time-to-Market for Mobile Phone Chipset in China

May 24, 2004 | Conteúdos Em Ingles

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T3G, a joint venture company of Datang Mobile Communications Equipment, Royal Philips Electronics and Samsung Electronics has chosen Cadence Incisive functional verification platform to verify IC and develop a reference design for China’s next-generation TD-SCDMA mobile phone.

 

T3G expertise has been built in providing handset companies with a complete solution that includes a system reference design, hardware platform, software, TD-SCDMA/GSM/GPRS dual-mode handset chipset design, and customized technical support. T3G said Cadence platform was selected because it provides the speed and efficiency to significantly reduce overall verification time, critical for faster time-to-market.

2004-05-24

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